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Hlavní stránka>IEC 62258-6:2006 - Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
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sklademVydáno: 2006-08-28
IEC 62258-6:2006 - Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

IEC 62258-6:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

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Anglicky Tisk
skladem
1144 Kč
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1144 Kč
Označení normy:IEC 62258-6:2006
Vydáno:2006-08-28
Jazyk:Anglicky
Popis

IEC 62258-6:2006

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2