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Current revisionPublished date: 01.05.1998
IPC-2225 - Standard Only
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
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| Standard Number: | IPC-2225 - Standard Only |
| Published date: | 01.05.1998 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 112 |
Popis
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. 44 pages. Released May 1998.