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Current revisionPublished date: 01.09.2017
IPC-2226 - Revision A
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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| Standard Number: | IPC-2226 - Revision A |
| Published date: | 01.09.2017 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-324-6 |
| Pages (English): | 48 |
| ISBN (Japanese): | 978-1-951577-02-5 |
| Pages (Japanese): | 48 |
Popis
IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new coverage of routing density factors and a complete rebuild of feature size recommendations, including aspect ratio, capture and target land sizes. Almost every graphic in Sections 3, 5 and 9 has been revised and/or supplemented with new graphics addressing various microvia formation processes and HDI constructions