IPC-6012 - Revision C
Qualification and Performance Specification for Rigid Printed Boards
| Standard Number: | IPC-6012 - Revision C |
| Published date: | 13.04.2010 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | C |
| Pages (English): | 52 |
| ISBN (French): | 978-1-61193-073-3 |
| Pages (French): | 52 |
| ISBN (Polish): | 1-580986-95-1 |
| Pages (Polish): | 52 |
Superseded by IPC-6012 - Revision D
Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue fluxes). Individual sections cover vacuum extraction of straight-through (round) leads; partially and fully-clinched leads, DIP and auxiliary heating techniques for large thermal mass boards and inaccessible leads. Details industry-approved rework techniques for solder defects, including solder bridges, icicles, and excess/insufficient solder. Includes both tin-lead and lead-free soldering techniques.