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Published date: 01.06.2019
IPC-7095 - Revision D - With Amendment 1
Design and Assembly Process Implementation for BGAs
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Chinese Zabezpečené PDF
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4124 Kč
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10-14 dní
6186 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
English Tisk
10-14 dní
6186 Kč
Japanese Zabezpečené PDF
K okamžitému stažení
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6186 Kč
Japanese Tisk
10-14 dní
9278 Kč
View table of Contents
| Standard Number: | IPC-7095 - Revision D - With Amendment 1 |
| Published date: | 01.06.2019 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | D |
| ISBN (English): | 978-1-61193-486-1 |
| Pages (English): | 208 |
| ISBN (Chinese): | 978-1-61193-491-5 |
| Pages (Chinese): | 208 |
| ISBN (Japanese): | 978-1-951577-22-3 |
| Pages (Japanese): | 208 |
Popis
Superseded by IPC-7095 - Revision E
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.