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Published date: 30.03.2017
IPC-7530 - Revision A
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Formát
Dostupnost
Cena a měna
Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
Chinese Tisk
10-14 dní
6186 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4124 Kč
English Tisk
10-14 dní
6186 Kč
Japanese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
5769 Kč
Japanese Tisk
10-14 dní
8654 Kč
View table of Contents
| Standard Number: | IPC-7530 - Revision A |
| Published date: | 30.03.2017 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-303-1 |
| Pages (English): | 42 |
| ISBN (Chinese): | 978-1-61193-466-3 |
| Pages (Chinese): | 52 |
| ISBN (Japanese): | 978-1-63816-099-1 |
| Pages (Japanese): | 52 |
Popis
Superseded by IPC-7530 - Revision B
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017