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Current revisionPublished date: 01.02.2022
IPC-9701 - Revision B
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
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| Standard Number: | IPC-9701 - Revision B |
| Published date: | 01.02.2022 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-63816-072-4 |
| Pages (English): | 24 |
Popis
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.