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Current revisionPublished date: 18.03.2009
IPC-9703 - Standard Only
IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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Cena a měna
Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4130 Kč
Chinese Tisk
10-14 dní
6196 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
2316 Kč
English Tisk
10-14 dní
3473 Kč
View table of Contents
| Standard Number: | IPC-9703 - Standard Only |
| Published date: | 18.03.2009 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 42 |
| ISBN (Chinese): | 978-1-61193-404-5 |
| Pages (Chinese): | 48 |
Popis
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. 42 pages. Released March 2009. Included in the C-103 and C-1000 Collections.