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Current revisionPublished date: 01.05.2018
IPC-9707 - Amendment 1
Spherical Bend Test Method for Characterization of Board Level Interconnects
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| Standard Number: | IPC-9707 - Amendment 1 |
| Published date: | 01.05.2018 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| ISBN (English): | 978-1-61193-376-5 |
| Pages (English): | 7 |
Popis
Base standard to this Amendment is available here
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations.