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Current revisionPublished date: 01.06.2026
IPC-HDBK-005 - Revision A
Requirements for Soldering Pastes
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| Standard Number: | IPC-HDBK-005 - Revision A |
| Published date: | 01.06.2026 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-63816-247-6 |
| Pages (English): | 70 |
Popis
The IPC-HDBK-005A handbook is a companion to the solder paste standard J-STD-005 and should be considered a guide for assessing the applicability of a solder paste for use in surface-mount technology (SMT) processes. The IPC-HDBK-005A document suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. The IPC-HDBK-005A has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres, and process variables currently available.
