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Current revisionPublished date: 01.10.2017
IPC-J-STD-006 - Revision C - Amendment 1
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
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| Standard Number: | IPC-J-STD-006 - Revision C - Amendment 1 |
| Published date: | 01.10.2017 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | C |
| ISBN (English): | 978-1-61193-326-0 |
| Pages (English): | 12 |
Popis
Base standard to this Amendment is available here
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the J-STD-006C standard.