IPC-J-STD-020 - Revision E
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
| Standard Number: | IPC-J-STD-020 - Revision E |
| Published date: | 03.02.2015 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | E |
| ISBN (English): | 978-1-61193-159-4 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-61193-204-1 |
| Pages (Chinese): | 16 |
| ISBN (Japanese): | 978-1-63816-028-1 |
| Pages (Japanese): | 24 |
| ISBN (Spanish): | 978-1-61193-365-9 |
| Pages (Spanish): | 24 |
Superseded by IPC-J-STD-020-Revision-F
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.
In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.