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Current revisionPublished date: 01.11.2025
IPC-T-50 - Revision P
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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| Standard Number: | IPC-T-50 - Revision P |
| Published date: | 01.11.2025 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | P |
| ISBN (English): | 978-1-63816-272-8 |
| Pages (English): | 106 |
| ISBN (Chinese): | 978-1-63816-306-0 |
| Pages (Chinese): | 106 |
Popis
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire harnesses, board packaging, sintered interconnects, soldering, fabrication processes and testing.