Přihlásit seRegistrovat se
Jazyk czen
Menu
KontaktOBCHODNÁPOVĚDANovinky
Hledání
0
Celková cena
0 Kč
Cena s DPH / bez DPH
Hlavní stránka>UNE EN 61190-1-3:2007 Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.)
Not available online - contact us!
sklademVydáno: 2007-12-01

UNE EN 61190-1-3:2007

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.)

Materiales de fijación para conjuntos electrónicos. Parte 1-3: Requisitos para aleaciones de soldadura electrónica y soldaduras sólidas con y sin fundente para aplicaciones de soldadura electrónica (IEC 61190-1-3:2007). (Ratificada por AENOR en diciembre de 2007.)

Měna
2 147 Kč
Označení normy:UNE EN 61190-1-3:2007
Počet stran:39
Vydáno:2007-12-01
Popis

This standard UNE EN 61190-1-3:2007 Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.) is classified in these ICS categories:

  • 31.190
:
Tisk