This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate , that is, active and passive devices embedded board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format should be used for simulation (e.g.,Stress, Thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is utilized for transferring information among printed board designers, printed board simulation engineer, manufactures, and assemblers. This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.