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Homepage>BSI Standards>31 ELEKTRONIKA>31.080 Polovodičové součástky>31.080.01 Polovodičové součástky obecně

31.080.01 Polovodičové součástky obecně

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172 results
First page124678...131415Last page
25/30509887 DC
Draft BS EN 63492-1 Semiconductor devices - Isolation for semiconductor devices Part 1: Failure mechanisms and measurement methods to evaluate solid insulation for semiconductor devices
Vydáno: 2025-02-06
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BS EN IEC 60749-34-1:2025
Semiconductor devices. Mechanical and climatic test methods Power cycling test for power semiconductor module
Vydáno: 2025-08-18
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BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Vydáno: 2010-06-30
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BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)
Vydáno: 2001-09-05
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BS IEC 62830-5:2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation Test method for measuring generated power from flexible thermoelectric devices
Vydáno: 2021-02-03
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BS EN IEC 60749-39:2022 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Vydáno: 2022-03-17
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18/30383935 DC
BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
Vydáno: 2018-12-04
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Vydáno: 2021-10-11
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BS EN 62415:2010
Semiconductor devices. Constant current electromigration test
Vydáno: 2010-07-31
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BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Vydáno: 2003-08-04
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PD ES 59008-5-2:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die with added connection structures
Vydáno: 2001-06-15
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BS EN IEC 60749-26:2018
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Vydáno: 2018-04-30
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172 results
First page124678...131415Last page