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BS EN 60749-23:2004+A1:2011
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Vydáno: 2011-06-30
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PD ES 59008-5-1:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die
Vydáno: 2001-07-15
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PD ES 59008-4-1:2001
Data requirements for semiconductor die. Specific requirements and recommendations Test and quality
Data requirements for semiconductor die. Specific requirements and recommendations Test and quality
Vydáno: 2001-03-15
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BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Vydáno: 2019-03-05
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BS IEC 63229:2021
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Vydáno: 2023-08-31
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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Vydáno: 2024-12-13
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BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
Vydáno: 2024-09-06
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BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Vydáno: 2024-09-06
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