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BS IEC 62899-203-2:2025
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Vydáno: 2025-06-24
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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Vydáno: 2014-10-31
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381.77 €
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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Qualification and performance of electrical insulating compound for printed wiring assemblies
Vydáno: 2014-06-30
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BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Vydáno: 2018-10-09
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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-06-30
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Vydáno: 2019-12-17
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