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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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257 results
First page123...111315...202122Last page
BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Vydáno: 2018-11-13
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BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Vydáno: 2018-05-18
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-24
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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Vydáno: 2014-05-07
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BS EN 61249-2-13:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
Vydáno: 1999-06-15
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BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Vydáno: 2017-11-16
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BS EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Vydáno: 2014-02-28
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BS EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Vydáno: 2005-08-09
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BS EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
Vydáno: 2006-02-01
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
Vydáno: 2008-03-31
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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Vydáno: 1989-08-31
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257 results
First page123...111315...202122Last page