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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Vydáno: 2015-06-30
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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Vydáno: 2002-06-21
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12/30262664 DC
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
Vydáno: 2012-04-04
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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Vydáno: 2012-03-31
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BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Vydáno: 2007-12-31
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Vydáno: 2021-08-20
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24/30498340 DC
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
Vydáno: 2024-08-02
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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Vydáno: 2024-02-07
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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Vydáno: 2022-11-30
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