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Published date: 01.11.2021
IPC-T-50 - Revision N
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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| Standard Number: | IPC-T-50 - Revision N |
| Published date: | 01.11.2021 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | N |
| ISBN (English): | 978-1-63816-038-0 |
| Pages (English): | 92 |
| ISBN (Chinese): | 978-1-63816-084-7 |
| Pages (Chinese): | 176 |
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Latest revision for IPC-T-50 is here
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing