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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Vydáno: 2022-01-11
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
Mechanical standardization of semiconductor devices Dimensions
Vydáno: 2020-04-02
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BS QC 750100:1986+A2:1996
Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
Vydáno: 2010-01-31
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BS EN 60749-9:2017
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Vydáno: 2017-11-27
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BS EN 60749-8:2003
Semiconductor devices. Mechanical and climatic test methods Sealing
Semiconductor devices. Mechanical and climatic test methods Sealing
Vydáno: 2003-07-03
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BS EN 60749-21:2011
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Solderability
Vydáno: 2011-08-31
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BS EN 62374:2007
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Vydáno: 2008-10-31
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