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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Vydáno: 2024-12-13
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BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
Vydáno: 2024-09-06
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BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Vydáno: 2024-09-06
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BS EN 60749-34:2010
Semiconductor devices. Mechanical and climatic test methods Power cycling
Semiconductor devices. Mechanical and climatic test methods Power cycling
Vydáno: 2011-02-28
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BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Vydáno: 2013-01-31
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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Vydáno: 2003-12-15
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BS EN 60745-1:2009+A11:2010
Hand-held motor-operated electric tools. Safety General requirements
Hand-held motor-operated electric tools. Safety General requirements
Vydáno: 2011-02-28
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BS EN 60749-19:2003+A1:2010
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Vydáno: 2010-10-31
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PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Vydáno: 2001-12-05
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