Cena s DPH / bez DPH
31.180 Plošné spoje a desky s plošnými spoji
Měna
Cena s DPH / bez DPH
Cena s DPH
BS 123400:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
Vydáno: 2001-12-17
Anglicky Zabezpečené PDF
K okamžitému stažení
4740 Kč
Anglicky Tisk
Skladem
4740 Kč
BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Vydáno: 2007-12-31
Anglicky Zabezpečené PDF
K okamžitému stažení
4740 Kč
Anglicky Tisk
Skladem
4740 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Vydáno: 2018-10-09
Anglicky Zabezpečené PDF
K okamžitému stažení
4740 Kč
Anglicky Tisk
Skladem
4740 Kč
BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-06-30
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
4740 Kč
Anglicky Tisk
Skladem
4740 Kč
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Vydáno: 2019-12-17
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Qualification and performance specification of permanent solder mask and flexible cover materials
Vydáno: 2014-06-30
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Vydáno: 2002-06-21
Anglicky Zabezpečené PDF
K okamžitému stažení
6600 Kč
Anglicky Tisk
Skladem
6600 Kč
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Vydáno: 2021-08-20
Anglicky Zabezpečené PDF
K okamžitému stažení
4740 Kč
Anglicky Tisk
Skladem
4740 Kč
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Vydáno: 2019-01-03
Anglicky Zabezpečené PDF
K okamžitému stažení
9180 Kč
Anglicky Tisk
Skladem
9180 Kč