Cena s DPH / bez DPH
31.190 Sestavy elektronických součástek
Měna
Cena s DPH / bez DPH
Cena s DPH
BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Vydáno: 2013-06-30
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8568 Kč
Anglicky Tisk
Skladem
8568 Kč
BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Vydáno: 2007-12-31
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Vydáno: 2003-06-26
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
7224 Kč
Anglicky Tisk
Skladem
7224 Kč
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Vydáno: 2021-10-11
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8568 Kč
Anglicky Tisk
Skladem
8568 Kč
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
9240 Kč
Anglicky Tisk
Skladem
9240 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
560 Kč
Anglicky Tisk
Skladem
560 Kč
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
Anglicky Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4424 Kč
Anglicky Tisk
Skladem
4424 Kč